Fuses

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Mounting Type	Fuse Type	Current Rating (Amps)	Voltage Rating - AC	Voltage Rating - DC	Response Time	Package / Case	Breaking Capacity @ Rated Voltage	Approval Agency	Operating Temperature	Color	Size / Dimension
ICP-S0.5TN FUSE BRD MNT 500MA 50VAC/VDC SMD Rohm Semiconductor	0 In Stock	2,000 : NT$9.76600 Tape & Reel (TR)	ICP-S	Tape & Reel (TR)	Obsolete	Surface Mount	Board Mount (Cartridge Style Excluded)	500 mA	50 V	50 V	Fast Blow	2-SMD, J-Lead	-	-	-55°C ~ 125°C	-	0.118" L x 0.098" W x 0.079" H (3.00mm x 2.50mm x 2.00mm)
ICP-S0.7TN FUSE BRD MNT 700MA 50VAC/VDC SMD Rohm Semiconductor	0 In Stock	2,000 : NT$9.76600 Tape & Reel (TR)	ICP-S	Tape & Reel (TR)	Obsolete	Surface Mount	Board Mount (Cartridge Style Excluded)	700 mA	50 V	50 V	Fast Blow	2-SMD, J-Lead	-	-	-55°C ~ 125°C	-	0.118" L x 0.098" W x 0.079" H (3.00mm x 2.50mm x 2.00mm)
ICP-S1.0TN FUSE BOARD MNT 1A 50VAC/VDC 2SMD Rohm Semiconductor	0 In Stock	2,000 : NT$9.76600 Tape & Reel (TR)	ICP-S	Tape & Reel (TR)	Obsolete	Surface Mount	Board Mount (Cartridge Style Excluded)	1 A	50 V	50 V	Fast Blow	2-SMD, J-Lead	-	-	-55°C ~ 125°C	-	0.118" L x 0.098" W x 0.079" H (3.00mm x 2.50mm x 2.00mm)
ICP-S1.8TN FUSE BRD MNT 1.8A 50VAC/VDC 2SMD Rohm Semiconductor	0 In Stock	2,000 : NT$9.76600 Tape & Reel (TR)	ICP-S	Tape & Reel (TR)	Obsolete	Surface Mount	Board Mount (Cartridge Style Excluded)	1.8 A	50 V	50 V	Fast Blow	2-SMD, J-Lead	-	-	-55°C ~ 125°C	-	0.118" L x 0.098" W x 0.079" H (3.00mm x 2.50mm x 2.00mm)
ICP-S2.3TN FUSE BRD MNT 2.3A 50VAC/VDC 2SMD Rohm Semiconductor	0 In Stock	2,000 : NT$9.76600 Tape & Reel (TR)	ICP-S	Tape & Reel (TR)	Obsolete	Surface Mount	Board Mount (Cartridge Style Excluded)	2.3 A	50 V	50 V	Fast Blow	2-SMD, J-Lead	-	-	-55°C ~ 125°C	-	0.118" L x 0.098" W x 0.079" H (3.00mm x 2.50mm x 2.00mm)

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A fuse is a device designed to stop current flow when it exceeds a certain limit (overcurrent protection). The devices works by creating an opening in a material situated between two end terminals. The material will melt (blow) from an increase in heat generated by the device as the current flow changes. The amount of time it takes the device to blow is often defined as fast or slow-blow.