MSP-EXP430G2 User Guide Datasheet by Texas Instruments

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MSP-EXP430G2 LaunchPad™ Development Kit
User's Guide
SLAU318GJuly 2010Revised March 2016
MSP-EXP430G2 LaunchPad™ Development Kit
The MSP-EXP430G2 LaunchPad development kit is an inexpensive and simple development kit for the
MSP430G2xx Value Line series of microcontrollers. It is an easy way to start developing on the MSP430
MCUs with on-board emulation for programming and debugging as well as buttons and LEDs for a simple
user interface.
Contents
1 Preface: Read This First .................................................................................................... 2
2 MSP-EXP430G2 LaunchPad™ Development Kit Overview ........................................................... 2
3 Installation .................................................................................................................... 5
4 Getting Started With MSP-EXP430G2 LaunchPad™ Development Kit .............................................. 6
5 Develop an Application With the MSP-EXP430G2 LaunchPad™ Development Kit ................................ 7
6 MSP-EXP430G2 Hardware ............................................................................................... 12
7 Suggested Reading ........................................................................................................ 23
8 Frequently Asked Questions (FAQ)...................................................................................... 23
List of Figures
1 MSP-EXP430G2 LaunchPad Development Kit Overview.............................................................. 3
2 Insert Device Into Target Socket .......................................................................................... 7
3 Code Composer Studio™ v4 in Debugging Mode ...................................................................... 8
4 MSP-EXP430G2 LaunchPad Development Kit With Attached eZ430-RF2500 Target Board..................... 9
5 Device Pinout ............................................................................................................... 12
6 Schematics, MSP-EXP430G2 Emulator (1 of 2), Revision 1.4 ...................................................... 13
7 Schematics, MSP-EXP430G2 Emulator (2 of 2), Revision 1.4 ...................................................... 14
8 Schematics, MSP-EXP430G2 Target Socket, Revision 1.4.......................................................... 15
9 Schematics, MSP-EXP430G2 Emulator (1 of 2), Revision 1.5 ...................................................... 16
10 Schematics, MSP-EXP430G2 Emulator (2 of 2), Revision 1.5 ...................................................... 17
11 Schematics, MSP-EXP430G2 Target Socket, Revision 1.5.......................................................... 18
12 Layout, MSP-EXP430G2 Top Layer..................................................................................... 19
13 Layout, MSP-EXP430G2 Bottom Layer................................................................................. 20
14 Layout, MSP-EXP430G2 Silkscreen..................................................................................... 21
List of Tables
1 Jumper Connection J3 Between Emulator and Target ................................................................. 8
2 eZ430™ Debugging Interface.............................................................................................. 9
3 Supported Devices......................................................................................................... 10
4 Features Supported by On-Board Emulator ............................................................................ 12
5 Bill of Materials ............................................................................................................. 22
Trademarks
MSP430, E2E, Code Composer Studio, LaunchPad, BoosterPack, eZ430 are trademarks of Texas
Instruments.
IAR Embedded Workbench is a trademark of IAR Systems.
All other trademarks are the property of their respective owners.
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Preface: Read This First
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1 Preface: Read This First
1.1 If You Need Assistance
If you have any feedback or questions, support for the MSP430™ MCUs and the MSP-EXP430G2 is
provided by the TI Product Information Center (PIC) and the TI E2E™ Forum. Contact information for the
PIC can be found on the TI website. Additional device-specific information can be found on the .
1.2 Related Documentation From TI
The primary sources of MSP430 information are the device-specific data sheets and user's guides
available at the website for MSP430 MCUs.
MSP430 MCU user's guides, application reports, software examples and other MSP430 MCU user's
guides can be found at the Tech Docs section. The Code Composer Studio™ v6.1 for MSP430 User's
Guide (SLAU157) includes detailed information on setting up a project and using Code Composer Studio
(CCS) for the MSP430 microcontroller.
Information about MSP debug solutions, supported IDEs, debug probes, and target devices can be found
in the MSP Debuggers User's Guide (SLAU647).
Information specific to the MSP-EXP430G2 LaunchPad™ development kit, all of the available IDEs,
software libraries, and examples can be found in the Technical Documents and Related Products sections
of the MSP-EXP430G2 page.
2 MSP-EXP430G2 LaunchPad™ Development Kit Overview
2.1 Overview
Rapid prototyping is simplified by the 20-pin BoosterPack™ plug-in module headers which support a wide
range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity,
graphical displays, environmental sensing, and much more. You can either design your own BoosterPack
plug-in module or choose among many already available from TI and third-party developers.
The LaunchPad development kit features an integrated DIP target socket that supports up to 20 pins,
allowing MSP430 Value Line devices to be plugged into the LaunchPad development kit. The MSP-
EXP430G2 LaunchPad development kit comes with an MSP430G2553 MCU by default. The
MSP430G2553 MCU has the most memory available of the compatible Value Line devices.
The MSP430G2553 16-bit MCU has 16KB of flash, 512 bytes of RAM, up to 16-MHz CPU speed, a 10-bit
ADC, capacitive-touch enabled I/Os, universal serial communication interface, and more – plenty to get
you started in your development.
Free software development tools are also available: TI's Eclipse-based Code Composer Studio™ IDE
(CCS), IAR Embedded Workbench™ IDE (IAR), and the community-driven Energia open source code
editor. More information about the LaunchPad development kit, including documentation and design files,
can be found on the tool page at http://www.ti.com/tool/msp-exp430g2.
2.2 Features
MSP-EXP430G2 LaunchPad development kit features:
USB debugging and programming interface featuring a driverless installation and application UART
serial communication with up to 9600 Baud
Supports MSP430G2xx2, MSP430G2xx3, and MSP430F20xx devices in PDIP14 or PDIP20 packages
(see Section 5.7 for a complete list of supported devices)
Two general-purpose digital I/O pins connected to green and red LEDs for visual feedback
Two push button for user feedback and device reset
Easily accessible device pins for debugging purposes or as socket for adding customized extension
boards
High-quality 20-pin DIP socket for an easy plug-in or removal of the target device
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MSP-EXP430G2 LaunchPad™ Development Kit
Figure 1. MSP-EXP430G2 LaunchPad Development Kit Overview
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2.3 Kit Contents
The MSP-EXP430G2 development kit includes the following hardware:
LaunchPad emulator socket board (MSP-EXP430G2)
Mini USB-B cable, 0.5 m
Two MSP430 flash-based MCUs
MSP430G2553: Low-power 16-bit MSP430 microcontroller with an 8-channel 10-bit ADC, on-chip
comparator, touch-sense enabled I/Os, universal serial communication interface, 16kB flash
memory, and 512 bytes of RAM (preloaded with a sample program)
MSP430G2452: Low-power 16-bit MSP430 microcontroller with an 8-channel 10-bit ADC, on-chip
comparator, touch-sense enabled I/Os, universal serial interface, 8kB flash memory, and 256 bytes
of SRAM
Two 10-pin PCB connectors female
32.768-kHz clock crystal from Micro Crystal (http://www.microcrystal.com)
Quick start guide
Two LaunchPad development kit stickers
2.4 Revisions
The first production revision of the LaunchPad development kit in 2010 was 1.3. In 2012 the LaunchPad
board revision changed from 1.4 to 1.5 to align with the new release of Value Line devices. The
differences in the schematic and the kit contents are:
Layout and Schematic:
Voltage feedback in the emulator changed to increase startup stability (Rev 1.3 to Rev 1.4)
Rearranged jumper J3 to support two UART configurations: vertical (SW UART), horizontal (HW
UART)
VCC on the connector J4 can now be disconnected from the emulator VCC by J3
Pullup resistor R34 and capacitor C24 on P1.3 removed to reduce the current consumption
Presoldered male headers J1 and J2
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Installation
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3 Installation
Installation of the MSP-EXP430G2 LaunchPad development kit consists of three easy steps:
1. Download the required software.
2. Install the selected IDE.
3. Connect the LaunchPad to the PC.
Then the LaunchPad development kit is ready to develop applications or to use the pre-programmed
demo application.
3.1 Download the Required Software
Different development software tools are available for the MSP-EXP430G2 LaunchPad development
board. IAR Embedded Workbench KickStart IDE and Code Composer Studio (CCS) IDE are both
available in a free limited version. IAR Embedded Workbench allows 4KB of C-code compilation. CCS is
limited to a code size of 16KB. The software is available at http://www.ti.com/mspds. There are many
other compilers and integrated development environments (IDEs) available to use with the MSP-EXP430
LaunchPad development kit including Rowley Crossworks and MSPGCC. However, example projects
have been created using IAR Embedded Workbench KickStart IDE and Code Composer Studio IDE
(CCS). For more information on the supported software and the latest code examples, visit the LaunchPad
development kit tool page (http://www.ti.com/tool/msp-exp430g2).
3.2 Install the Software
Download one of the integrated development environments (IDEs) (see Section 3.1). IAR KickStart and
CCS offer the required driver support to work with the MSP-EXP430 LaunchPad development kit onboard
emulation. Once installed, the IDE should find the MSP-EXP430G2 LaunchPad development kit as
USB:HID debugging interface. Now all is set for developing MSP430G2xx based application on the
LaunchPad development kit.
3.3 Install the Hardware
Connect the MSP-EXP430G2 LaunchPad socket board with the enclosed USB cable to a PC. The driver
installation starts automatically. If prompted for software, allow Windows to install the software
automatically. This is possible only if either IAR KickStart or CCS is already installed.
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4 Getting Started With MSP-EXP430G2 LaunchPad™ Development Kit
4.1 Getting Started
The first time the MSP-EXP430G2 LaunchPad development kit is used, a demo application automatically
starts as soon as the board is powered from the USB host. To start the demo, connect the MSP-
EXP430G2 LaunchPad development kit with the included mini USB cable to a free USB port. The demo
application starts with an LED toggle to show the device is active. More information about the demo
application can be found in Section 4.2.
4.2 Demo Application, Internal Temperature Measurement
The LaunchPad development kit includes a pre-programmed MSP430G2553 device already installed in
the target socket. When LaunchPad development kit is connected via USB, the demo starts with an LED
toggle sequence. The onboard emulation generates the supply voltage and all the signals necessary to
start.
Press button P1.3 to switch the application to a temperature measurement mode. A reference temperature
is taken at the beginning of this mode, and the LEDs of the LaunchPad development kit signal a rise or fall
in temperature by varying the brightness of the on-board red or green LED, respectively. The reference
temperature can also be recalibrated with another button press on P1.3. The collected temperature data is
also communicated via back-channel UART through the USB emulation circuitry back to the PC. The
internal temperature sensor data from the MSP430G2553 device is sent to the PC to be displayed on the
GUI. The pre-loaded demo application and the GUI are found in the Software Examples zip folder. The
GUI is opened with LaunchPad_Temp_GUI.exe. This GUI is made with Processing (http://processing.org)
with the source available for customization. The serial communication port on the PC must be configured
with 2400 bps, one stop bit, and no flow control to display the values correctly.
The demo application uses the on-chip peripherals of the MSP430G2553 device such as the 10-bit ADC,
which samples the internal temperature sensor, and 16-bit timers, which drive the PWM to vary brightness
of the LEDs and enable software UART for communication with the PC. The MSP430G2553 offers a USCI
interface that is capable of communicating through UART at up to 2 MBaud, but to be aligned with all the
other MSP430G2xx devices, the demo uses the Timer UART implementation, which can be used on all
the other devices. This way the demo can be used with any other MSP430G2xx device with an integrated
ADC, without any change in the program.
The provided applications can be a great starting point for various custom applications and give a good
overview of the various applications of the MSP430G2xx Value Line devices.
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5 Develop an Application With the MSP-EXP430G2 LaunchPad™ Development Kit
5.1 Developing an Application
The integrated development environments (IDEs) shown in Section 3 offer support for the whole
MSP430G2xx Value Line. The MSP-EXP430G2 LaunchPad development kit needs only a connection to
the USB of the Host PC—there is no external hardware required. The power supply and the Spy-Bi-Wire
JTAG signals TEST and RST must be connected with jumper J3 to allow the onboard emulation
connection to the device. Now the preferred device can be plugged into the DIP target socket of the
LaunchPad development kit (see Figure 2). Both PDIP14 and PDIP20 devices of the MSP430G2xx Value
Line and the MSP430F20xx family can be inserted into the DIP socket aligned to pin 1. A complete list of
supported devices can be found in Section 5.7.
Figure 2. Insert Device Into Target Socket
The following example for Code Composer Studio shows how to download and debug the demo
application described in Section 4.2.
5.2 Program and Debug the Temperature Measurement Demo Application
The source code of the demo application can be found in the Software Examples zip folder. Download the
project folder and unpack it to a location of your choice. For this demo, Code Composer Studio v4 or
newer must be installed.
The demo application can be loaded to the CCS workspace by clicking FileImport. Select the location of
the extracted project files and import Existing projects into Workspace. Now the MSP-EXP430G2-
Launchpad project appears inside the CCS workspace. The project must be marked as the active project
to start programming and debugging the device.
Connect the LaunchPad development kit with an inserted MSP430G2553 device to the host PC and click
the Debug button on the CCS Toolbar. The MSP-EXP430G2 LaunchPad development kit is initialized and
the download of the compiled demo application starts. The CCS view switches to a debugging interface
once the download is completed and the application is ready to start. Figure 3 shows Code Composer
Studio v4 with the MSP-EXP430G2 LaunchPad development kit demo application in debug view.
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Figure 3. Code Composer Studio™ v4 in Debugging Mode
5.3 Disconnect Emulator From Target With Jumper J3
The connection between the MSP-EXP430G2 emulator and the attached target device can be opened
with the jumper array J3. This can be useful to access an attached eZ430™ target board by disconnecting
the Spi-Bi-Wire JTAG lines RST and TEST or if the JTAG lines are used for other application purposes.
The jumper array can also be used to measure the power consumption of the LaunchPad development kit
application. For this intention, all connections except VCC must be opened, and a multi meter can used on
the VCC Jumper to measure the current of the MSP-EXP430G2 target device and its peripherals. The
jumper J5 VCC also must be opened if the LaunchPad development kit is powered with an external power
supply over J6 Table 1 or the eZ430 interface J4.
NOTE: The assignment of jumper J3 has been changed in MSP-EXP430G2 revision 1.5, see the
comments in Table 1 to find the assignment for a specific board revision.
Table 1. Jumper Connection J3 Between Emulator and Target
Jumper Signal Description
1 VCC Target socket power supply voltage (power consumption test jumper) (located on 5 before Rev. 1.5)
2 TEST Test mode for JTAG pins or Spy-Bi-Wire test clock input during programming and test (located on 1 before
Rev. 1.5)
3 RST Reset or Spy-Bi-Wire test data input/output during programming and test (located on 2 before Rev. 1.5)
4 RXD UART receive data input (direction can be selected by jumper orientation) (located on 3 before Rev. 1.5)
5 TXD UART transmit data output (direction can be selected by jumper orientation) (located on 4 before Rev. 1.5)
Jumpers 4 and 5 connect the UART interface of the emulator to the target device pins P1.1 and P1.2.
These jumpers can be used to select between a software (SW) UART or a hardware (HW) UART by their
orientation. In vertical orientation (SW UART), the jumpers connect the emulation TXD signal to target
P1.2 and the emulation RXD signal to target P1.1, as they are used for the software UART communication
on the demo application (see Section 3.2). In horizontal orientation (HW UART), the jumpers connect the
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emulator TXD signal to target P1.1 and the emulator RXD to target P1.2, as required for the USCI module.
Keep in mind that UART communication is full duplex, so connections are made for both transmit and
receive on each side, and the labeling is specific to what action each side of the UART bus is performing.
For example, the emulator TXD (transmit) signal connects to the target RXD (receive) signal, and the
emulator RXD signal connects to the target TXD signal.
5.4 Program Connected eZ430™ Target Boards
The MSP-EXP430G2 LaunchPad development kit can program the eZ430-RF2500T target boards, the
eZ430-Chronos watch module, or the eZ430-F2012T/F2013T. To connect one of the ez430 targets,
connector J4 must be populated with a 0.050-in (1.27-mm) pitch male header, as shown in Figure 4.
Figure 4. MSP-EXP430G2 LaunchPad Development Kit With Attached eZ430-RF2500 Target Board
To program the attached target without interfering with the socket board of the LaunchPad development
kit, jumper connections TEST and RST of J3 must be open. The interface to the eZ430 target board is
always connected to the MSP-EXP430G2 emulator, so the programming and debugging of a target device
connected to the LaunchPad development kit is possible only if the eZ430 target is not connected on the
same time. The application UART, on the other hand, is connected directly to the target device on the
LaunchPad development kit, and jumper J3 can be closed to monitor the transmission from the
LaunchPad target to the attached eZ430. This way both possible connections, from the device to the PC
and from the device to the eZ430, can be established without changing the direction of the UART pins.
The VCC connection to the eZ430 interface is directly connected to the target VCC of the LaunchPad
development kit and can be separated with jumper J3, if the LaunchPad development kit itself should be
powered from a connected battery on J4. To supply the eZ430 interface with the onboard emulator, close
jumper J3 VCC.
Table 2 shows the pinout of the eZ430 debugging interface J4, the first pin is the left pin located on the
emulator part of the LaunchPad development kit.
Table 2. eZ430™ Debugging Interface
Pin Signal Description
1 TXD UART transmit data output (UART communication from PC or MSP430G2xx to eZ430 target board)
2 VCC Power supply voltage (J3 VCC needs to be closed to supply via onboard emulator)
3 TEST / SBWTCK Test mode for JTAG pins and Spy-Bi-Wire test clock input during programming and test
4 RST / SBWTDIO Reset, Spy-Bi-Wire test data input/output during programming and test
5 GND Power supply ground
6 RXD UART receive data input (UART communication from eZ430 target board to PC or MSP430G2xx)
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5.5 Connecting a Crystal Oscillator
The MSP-EXP430G2 LaunchPad development kit offers a footprint for a variety of crystal oscillators. The
XIN and XOUT signals of the LFXT1 oscillator can support low-frequency oscillators like a watch crystals
of 32768 Hz or a standard crystal with a range defined in the associated data sheet. The signal lines XIN
and XOUT can also be used as multipurpose I/Os or as a digital frequency input. More information on the
possibilities of the low-frequency oscillator and the possible crystal selection can be found in the
MSP430x2xx Family User's Guide (SLAU144) or the device-specific data sheet.
The oscillator signals are connected to J2 to use the signals on an attached application board. In case of
signal distortion of the oscillator signals that leads to a fault indication at the basic clock module, resistors
R29 and R28 can be used to disconnect the pin header J2 from the oscillating lines.
5.6 Connecting a BoosterPack™ Plug-in Module
The LaunchPad development kit can connect to many BoosterPack plug-in modules within the ecosystem.
Headers J1 and J2 of the BoosterPack plug-in module, along with power supply J6, fall on a 100-mil (0.1-
in) grid to allow for easy and inexpensive development with a breadboard. The LaunchPad development
kit adheres to the 20-pin LaunchPad development kit pinout standard. A standard was created to aid
compatibility between LaunchPad development kits and BoosterPack plug-in modules across the TI
ecosystem.
The 20-pin standard is backward compatible with the 40-pin standard used by LaunchPad development
kits like the MSP-EXP430F5529LP. This allows a subset of some 40-pin BoosterPack plug-in modules to
be used with 20-pin LaunchPad development kits.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The LaunchPad
development kit is compatible with all 20-pin (and 40-pin) BoosterPack plug-in modules that are compliant
with the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly indicate
compatibility with the MSP430G2 LaunchPad development kit, compare the schematic of the candidate
BoosterPack plug-in module with the LaunchPad development kit to ensure compatibility. Keep in mind
that sometimes conflicts can be resolved by changing the G2 device pin function configuration in software.
More information about compatibility can also be found at http://www.ti.com/launchpad.
5.7 Supported Devices
TI offers several MSP430 MCUs in a PDIP package that are compatible with this LaunchPad development
kit. Table 3 shows the supported devices.
Table 3. Supported Devices
Part Number Family Description
MSP430F2001 F2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 128B RAM, Comparator
MSP430F2002 F2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C
MSP430F2003 F2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 128B RAM, 16-Bit Sigma-Delta A/D, USI for SPI/I2C
MSP430F2011 F2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 128B RAM, Comparator
MSP430F2012 F2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C
MSP430F2013 F2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 128B RAM, 16-Bit Sigma-Delta A/D, USI for SPI/I2C
MSP430G2001 G2xx 16-bit Ultra-Low-Power Microcontroller, 512B Flash, 128B RAM
MSP430G2101 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 128B RAM
MSP430G2111 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 128B RAM, Comparator
MSP430G2121 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 128B RAM, USI for SPI/I2C
MSP430G2131 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C
MSP430G2201 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 128B RAM
MSP430G2211 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 128B RAM, Comparator
MSP430G2221 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 128B RAM, USI for SPI/I2C
MSP430G2231 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C
MSP430G2102 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 256B RAM, USI for SPI/I2C, 16 Capacitive-Touch
Enabled I/O Pins
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Table 3. Supported Devices (continued)
Part Number Family Description
MSP430G2202 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, USI for SPI/I2C, 16 Capacitive-Touch
Enabled I/O Pins
MSP430G2302 G2xx 16-bit Ultra-Low-Power Microcontroller, 4KB Flash, 256B RAM, USI for SPI/I2C, 16 Capacitive-Touch
Enabled I/O Pins
MSP430G2402 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 256B RAM, USI for SPI/I2C, 16 Capacitive-Touch
Enabled I/O Pins
MSP430G2112 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 256B RAM, Comparator, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2212 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, Comparator, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2312 G2xx 16-bit Ultra-Low-Power Microcontroller, 4KB Flash, 256B RAM, Comparator, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2412 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 256B RAM, Comparator, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2132 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2232 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2332 G2xx 16-bit Ultra-Low-Power Microcontroller, 4KB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2432 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C,
16 Capacitive-Touch Enabled I/O Pins
MSP430G2152 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 256B RAM, 10-Bit SAR A/D, Comparator, USI for
SPI/I2C, 16 Capacitive-Touch Enabled I/O Pins
MSP430G2252 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, 10-Bit SAR A/D, Comparator, USI for
SPI/I2C, 16 Capacitive-Touch Enabled I/O Pins
MSP430G2352 G2xx 16-bit Ultra-Low-Power Microcontroller, 4KB Flash, 256B RAM, 10-Bit SAR A/D, Comparator, USI for
SPI/I2C, 16 Capacitive-Touch Enabled I/O Pins
MSP430G2452 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 256B RAM, 10-Bit SAR A/D, Comparator, USI for
SPI/I2C, 16 Capacitive-Touch Enabled I/O Pins
MSP430G2153 G2xx 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 256B RAM, 10-Bit SAR A/D, Comparator, USCI for
I2C/SPI/UART, 24 Capacitive-Touch Enabled I/O Pins
MSP430G2203 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, Comparator, USCI for I2C/SPI/UART,
24 Capacitive-Touch Enabled I/O Pins
MSP430G2313 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, Comparator, USCI for I2C/SPI/UART,
24 Capacitive-Touch Enabled I/O Pins
MSP430G2333 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, 10-Bit SAR A/D, Comparator, USCI for
I2C/SPI/UART, 24 Capacitive-Touch Enabled I/O Pins
MSP430G2353 G2xx 16-bit Ultra-Low-Power Microcontroller, 2KB Flash, 256B RAM, 10-Bit SAR A/D, Comparator, USCI for
I2C/SPI/UART, 24 Capacitive-Touch Enabled I/O Pins
MSP430G2403 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 512B RAM,, Comparator, USCI for I2C/SPI/UART,
24 Capacitive-Touch Enabled I/O Pins
MSP430G2413 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 512B RAM, Comparator, USCI for I2C/SPI/UART,
24 Capacitive-Touch Enabled I/O Pins
MSP430G2433 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 512B RAM, 10-Bit SAR A/D, Comparator, USCI for
I2C/SPI/UART, 24 Capacitive-Touch Enabled I/O Pins
MSP430G2453 G2xx 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 512B RAM, 10-Bit SAR A/D, Comparator, USCI for
I2C/SPI/UART, 24 Capacitive-Touch Enabled I/O Pins
MSP430G2513 G2xx 16-bit Ultra-Low-Power Microcontroller, 16KB Flash, 512B RAM, Comparator, USCI for I2C/SPI/UART,
24 Capacitive-Touch Enabled I/O Pins
MSP430G2533 G2xx 16-bit Ultra-Low-Power Microcontroller, 16KB Flash, 512B RAM, 10-Bit SAR A/D, Comparator, USCI for
I2C/SPI/UART, 24 Capacitive-Touch Enabled I/O Pins
MSP430G2553 G2xx 16-bit Ultra-Low-Power Microcontroller, 16KB Flash, 512B RAM, 10-Bit SAR A/D, Comparator, USCI for
I2C/SPI/UART, 24 Capacitive-Touch Enabled I/O Pins
l TEXAS INSTRUMENTS DvcclIow 14i20 DDvss P10 (LEDMJ: 2 13i19 DXlN/F26 P11 (UARTHI 3 12i18 DXOUT/P27 P12 (UARTHI 4 N“ 11in DTEST/SBWTCK P1.3 (SZHI 5 10:16 DW/NMIISBWTDI (S1) P1.4|:|: 6 9E1SDF17 6 (LEDZ) 5 mm 4 EIP2 3
Develop an Application With the MSP-EXP430G2 LaunchPad™ Development Kit
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5.8 MSP-EXP430G2 On-Board Emulator
The MSP-EXP430G2 on-board emulator enables programming and debugging of supported MSP430
MCUs (see Section 5.7). It offers several features that are enabled by a 2-wire JTAG interface called Spy-
Bi-Wire. For a more feature-complete emulator, the MSP-FET430UIF flash emulation tool may be more
appropriate. See Table 4 for more details on the on-board emulator of the MSP-EXP430G2 LaunchPad
development kit.
Table 4. Features Supported by On-Board Emulator
Feature Support by MSP-EXP430G2
LaunchPad™ Development
Kit
Supports MSP430F20xx, F21x2, F22xx, G2x01, G2x11, G2x21, G2x31, G2x53
Allows fuse blow
Adjustable target supply voltage
Fixed 2.8-V target supply voltage
Fixed 3.6-V target supply voltage
4-wire JTAG
2-wire JTAG
Application UART
Supported by CCS
Supported by IAR
6 MSP-EXP430G2 Hardware
6.1 Device Pinout
Figure 5. Device Pinout
TP 'P 'P rmnsnaw LTEWE’A ozo 3mUAw®fime M 1:er zmuwmxummwumSPA Duncamj. ZCEUmI ENC" Dam" V\m\N®H® QRNHmm U3 wjmmn Aka {L} TEXAS INSTRUMENTS
GND
GND
47k
100n
47k 47k
10n
16p
16p
1u/6.3V
100R
100R
100R
100R
12MHz
270
green
GND
SL127L6TH
MSP-EXP430G2 EMULATOR 1/2
1.4
R1
C5 R2 R3
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
1
2
3
4
5
6
7
8
9
11
12
13
14
15
10
C1
C3C2
C4
R5
R4
TP1
TP2
TP3
TP4
TP5
TP6
TP7
R6
R7
Q1
R26
LED0
12
34
56
78
910
J3
J4
2
1
4
3
5
6
HTCK
HTMS
HTDI
HTDO
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
GND
GND
GND
RESET
RESET
URXD
UTXD
SCL
SDA
SBWTCK
SBWTCK
SBWTDIO
SBWTDIO
CLK3410
RST3410
BTXD
BRXDI
BTXDI
BRXD
EZ_VBUS
TEST/SBWTCK
RST/SBWTDIO
URTS
UDTR
UDSR
UCTS
VCC
P1.2
P1.2
P1.1
P1.1
Removed U2: SN75240PW from SBW connections
SBW & UART I/F to Argon
SBW & UART I/F to external Target
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6.2 Schematics
Figure 6. Schematics, MSP-EXP430G2 Emulator (1 of 2), Revision 1.4
{L} TEXAS INSTRUMENTS :Q m a; A , n L n 3. 5 6. .'_H__ , ‘ m dim" 3mu‘mxuom‘um<.: ‘lf="" 1="" .5932="" 2:35:="" nmc"="" ea"="" emhmg="" ens="" u:="" mjmm:="" ns="">
Connector
Mini USB
GND
GND
GND
TUSB3410VF
GND GND
GND
CAT24FC32UI
33k
33R
33R
22p
22p
100n
100n
100k/1%
100k/1%
1k5
100n
1k5
1k5
100R
33k
10k 15k
1u/6.3V
GND
GND
TPS77301DGK
GND
GND
100n 61k5
33k
3k3
1u/6.3V
1N4148
GND
3k3
GND
47k
47k
USB_MINI_B5
GND
MSP-EXP430G2 EMULATOR 2/2
1.4
DNP
CLKOUT
22
SIN
17
TEST0 23
SDA
10
TEST1 24
RTS 20
VCC1 25
VDD18 4
PUR 5
DM 7
DTR 21
SCL
11
DSR 14
P3.4
29
X2
26 X1
27
SUSPEND
2
SOUT
19 DCD 15
CTS 13
DP 6
RI/CP 16
VCC 3
GND1 18
GND 8
VREGEN
1
RESET
9
WAKEUP
12
P3.3
30 P3.1
31 P3.0
32
GND2 28
U3
E0
1SDA 5
VSS
4
E1
2
WC 7
SCL 6
VCC 8
E2
3
U5
R21
R15
R14
C10
C9
C12
C11
R20
R18
R13
C13
R25
R24
R23
R12
R10 R11
C8
IN1
5OUT1 8
EN
4
IN2
6
RES 2
OUT2 7
FB 1
GND
3
U2
C7 R8
R9
R19
C6
D1
R22
R17
R16
IO1 3
VCC 1
IO2 5
GND 4
NC 2
VBUS
1
ID
4
D-
2
U$2
D+
3
GND
5
SHIELD1
S1
SHIELD2
S2
SHIELD3
S3
SHIELD4
S4
EZ_VCC
EZ_VCC EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
SDA
SCL
UTXD
URXD
RESET
CLK3410
RST3410
BRXDI
BTXDI
EZ_D+
EZ_D-
EZ_VBUS
EZ_VBUS
UCTS
UDSR
URTS
UDTR
VCC = +3.6V
DNP
MSP-EXP430G2 Hardware
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Figure 7. Schematics, MSP-EXP430G2 Emulator (2 of 2), Revision 1.4
(cc :71 i ‘ ‘7: jjrm" ZmumeUmwwanR.» Goncsmj. ZCSUmV" Dmcu Ema" V\m\mmm_,® m$Mumw U: mjmm: m\w {9 TEXAS INSTRUMENTS
GND
270R
10uF/10V
GND
GND
green
GND
470R
red
12pF
12pF
100nF
100nF
QUARZ5
GND
47K 47K
1nF
GND
0R
0R
MSP-EXP430G2 TARGET SOCKET
Ext_PWR
Socket: TBD
Type: TBD
DNP
DNP
DNP
DNP
1.4
R32
C23
1
2
3
J6
11
12
13
14
15
16
17
18
19
20
J2
1
2
3
4
5
6
7
8
9
10
J1
LED1
1 2
S1
1 2
S2
R33
LED2
C22
C21
C24
C20
Q2
R34
1
2
3
4
IC1
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
R27
C14
1
2
J5-1
3
4
J5-2
R28
R29 GND
P1.3
P1.3
XOUT
XOUT
XIN XIN
RST/SBWTDIO
RST/SBWTDIO
TEST/SBWTCK
P1.4
P1.5
VCC
VCC
P1.1
P1.2
P1.6
P1.6
P1.7
P2.0
P2.1
P2.2 P2.3
P2.4
P2.5
XINR
XOUTR
P1.0
P1.0
20 Pin Socket
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Figure 8. Schematics, MSP-EXP430G2 Target Socket, Revision 1.4
L iTwPE’ {FTEMS INSTRUMENTS TF’ TP 'P rpvrpsnaw ozo 3wUAw®fime w 1:er :wuwmxummwumfiph Dancamj. ZCEUmI ENC" Dmfim" m\Nm\N®pM mensm U: mjmm: Aka
GND
GND
47k
100n
47k 47k
10n
16p
16p
1u/6.3V
100R
100R
100R
100R
12MHz
270
green
GND
SL127L6TH
MSP-EXP430G2 EMULATOR 1/2
1.5
R1
C5 R2 R3
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
1
2
3
4
5
6
7
8
9
11
12
13
14
15
10
C1
C3
C2
C4
R5
R4
TP1
TP2
TP3
TP4
TP5
TP6
TP7
R6
R7
Q1
R26
LED0
J4
2
1
4
3
5
6
1
2
3
4
5
6
7
8
9
10
J3
HTCK
HTMS
HTDI
HTDO
EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
GND
GND
GND
RESET
RESET
URXD
UTXD
SCL
SDA
SBWTCK
SBWTCK
SBWTDIO
SBWTDIO
CLK3410
RST3410
BTXD
BTXD
BRXDI
BTXDI BRXD
BRXD
EZ_VBUS
TEST/SBWTCK
RST/SBWTDIO
URTS
UDTR
UDSR
UCTS
VCC
VCC
P1.2
P1.2
P1.1
P1.1
SBW & UART I/F to Argon
SBW & UART I/F to external Target
changed on Rev 1.5
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Figure 9. Schematics, MSP-EXP430G2 Emulator (1 of 2), Revision 1.5
{L} TEXAS INSTRUMENTS i Emu :OL :6, m a; A n 5 , n 9 F‘: H H u , M m., 1:er Zmuwmxummwumffim ‘l—A‘ 1 muncgmi zcaum: nmc" Dam“ m\Nm\M®HM mensm U3 wjmm: M\w
Connector
Mini USB
GND
GND
GND
TUSB3410VF
GND GND
GND
CAT24FC32UI
33k
33R
33R
22p
22p
100n
100n
100k/1%
100k/1%
1k5
100n
1k5
1k5
100R
33k
10k 15k
1u/6.3V
GND
GND
TPS77301DGK
GND
GND
100n 61k5
30k
3k3
1u/6.3V
1N4148
GND
3k3
GND
47k
47k
USB_MINI_B5
GND
MSP-EXP430G2 EMULATOR 2/2
1.5
DNP
CLKOUT
22
SIN
17
TEST0 23
SDA
10
TEST1 24
RTS 20
VCC1 25
VDD18 4
PUR 5
DM 7
DTR 21
SCL
11
DSR 14
P3.4
29
X2
26 X1
27
SUSPEND
2
SOUT
19 DCD 15
CTS 13
DP 6
RI/CP 16
VCC 3
GND1 18
GND 8
VREGEN
1
RESET
9
WAKEUP
12
P3.3
30 P3.1
31 P3.0
32
GND2 28
U3
E0
1SDA 5
VSS
4
E1
2
WC 7
SCL 6
VCC 8
E2
3
U5
R21
R15
R14
C10
C9
C12
C11
R20
R18
R13
C13
R25
R24
R23
R12
R10 R11
C8
IN1
5OUT1 8
EN
4
IN2
6
RES 2
OUT2 7
FB 1
GND
3
U2
C7 R8
R9
R19
C6
D1
R22
R17
R16
IO1 3
VCC 1
IO2 5
GND 4
NC 2
VBUS
1
ID
4
D-
2
U$2
D+
3
GND
5
SHIELD1
S1
SHIELD2
S2
SHIELD3
S3
SHIELD4
S4
EZ_VCC
EZ_VCC EZ_VCC
EZ_VCC
EZ_VCC
EZ_VCC
SDA
SCL
UTXD
URXD
RESET
CLK3410
RST3410
BRXDI
BTXDI
EZ_D+
EZ_D-
EZ_VBUS
EZ_VBUS
UCTS
UDSR
URTS
UDTR
VCC = +3.6V
DNP
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Figure 10. Schematics, MSP-EXP430G2 Emulator (2 of 2), Revision 1.5
{9 TEXAS INSTRUMENTS H E E L. in , :jrm" ZmumeUmmwanHb UDOCSQJ. ZCSUmV" Dmcu Ema" m\Mm\M®HN mimusm U3 mjmm: m\w
GND
270R
10uF/10V
GND
GND
green
GND
470R
red
12pF
12pF
100nF
100nF
QUARZ5
GND
47K 47K
1nF
GND
0R
0R
MSP-EXP430G2 TARGET SOCKET
Ext_PWR
Socket: TBD
Type: TBD
DNP
DNP
DNP
DNP
1.5
R32
C23
1
2
3
J6
11
12
13
14
15
16
17
18
19
20
J2
1
2
3
4
5
6
7
8
9
10
J1
LED1
1 2
S1
1 2
S2
R33
LED2
C22
C21
C24
C20
Q2
R34
1
2
3
4
IC1
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
R27
C14
1
2
J5-1
3
4
J5-2
R28
R29 GND
P1.3
P1.3
XOUT
XOUT
XIN XIN
RST/SBWTDIO
RST/SBWTDIO
TEST/SBWTCK
P1.4
P1.5
VCC
VCC
P1.1
P1.2
P1.6
P1.6
P1.7
P2.0
P2.1
P2.2 P2.3
P2.4
P2.5
XINR
XOUTR
P1.0
P1.0
20 Pin Socket
MSP-EXP430G2 Hardware
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Figure 11. Schematics, MSP-EXP430G2 Target Socket, Revision 1.5
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MSP-EXP430G2 Hardware
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MSP-EXP430G2 LaunchPad™ Development Kit
6.3 PCB Layout
Figure 12. Layout, MSP-EXP430G2 Top Layer
.© .© .© .© .© ..© .© H©
MSP-EXP430G2 Hardware
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Figure 13. Layout, MSP-EXP430G2 Bottom Layer
*9 TEXAS INSTRUMENTS @ 3330 355.3 wwmmmmwéo @azm 0%". 0 020 o wry—NEE:— 0 ma 533 as...» 609 0 QE 5 o Casmo o O 1m.Nn_ . o o m. 0 l c o O TNQ O O O D O D 0 RS :33 o o o oIlIllIIel lollllllt 0 e013 ANDMIU a O O o O 0 NE". D o o a O 0 ._.mn_ 0433 c O O o ANwV mlwuo O O Emu: mmammu O O CHEDV NJQ O o D n. o o O m_.Dox O O n 2.3ch diva o O 0 O o ZHX O O o AHDMIC 81?; o O O maze WES O O UUD M. O 2 0T 0 Ne w. o o o 1 m @ um um Um um um um J8 magma o m Immuonmnvn mmlnanmm I In: ZOH._.¢|_DEU mum um mm “a. can Lego non nmoa. DEo ca. n n mmomu o o o o a .0 o a 0 may . 3am mm a o a? o 1 o w a .. "mnemomsmwom c a 0U 0“. "fl 0 o m Mo son a a E 0 we n can 405 w o 302 902 mm” M o 02 O O O O O Mum-mnouflnmnmnfla: Wu C . oNEmem:ENSo on o o
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Figure 14. Layout, MSP-EXP430G2 Silkscreen
l TEXAS INSTRUMENTS
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6.4 Bill of Materials (BOM)
Table 5. Bill of Materials
Pos. Ref Name Number
per Board Description
1 C2, C3 2 16pF 0402 (33 pF on Rev 1.3)
2 C9, C10 2 22pF 0402
3 C1 1 10nF 0402
4 C5, C7, C11, C12, C13 5 100nF 0402
5 C4, C6, C8 3 1µF, 6.3V 0604
6 D1 1 1N4148 MicroMELF
7 EZ_USB 1 Mini-USB connector
8 Q1 1 SMD oscillator 12 MHz
9 R1, R2, R3, R16, R17 3 47k 0402 (R16, R17 is not populated)
10 R8 1 61k5 0402 (6k8 in Rev 1.3 and prior)
11 R19, R22 2 3k3 0402
12 R9 1 30k 0402 (3k3 in Rev 1.3 and prior)
13 R12, R21 2 33k 0402
14 R4, R5, R6, R7, R23 5 100R 0402
15 R14, R15 2 33R 0402
16 R18, R20 2 100k 0402
17 R13, R24, R25 3 1k5 0402
18 R10 1 10k 0402
19 R11 1 15k 0402
20 U1 1 MSP430F1612IPMR
21 U4 1 TPD2E001DRLR
22 U3 1 TUSB3410VF
23 U2 1 TPS77301DGKR
24 U5 1 I2C EEPROM 128k (AT24C128-10TU-2.7)
25 TP1, TP2, TP3, TP4,
TP5, TP6, TP7
26 C14 1 1nF, SMD 0603
27 C21, C22 12.5pF, SMD 0603 (not populated)
28 C23 1 10µF, 10 V, SMD 0805
29 C20, C24 1 100nF, SMD 0603 (C24 is not populated)
30 LED0, LED1 2 Green DIODE 0603
31 LED2 1 Red DIODE 0603
32 R34, R27 1 47k SMD 0603 (R34 is not populated)
33 R32, R26 2 270R SMD 0603
34 R33 1 470R SMD 0603
35 R28, R29 2 0R SMD 0603
36 IC1 1 DIP20 socket
37 Q2 Clock crystal 32kHz (Micro Crystal MS3V-T1R 32.768kHz CL:12.5pF ±20ppm
included)
38 J1, J2, 2 10-pin header, TH, 2.54mm male (female header included)
39 J3 1 2X05 pin header male
40 J4 6 pin header male 1.28mm
41 J5 1 2x02 pin header male
42 J6 2 3-pin header, male, TH
43 S1, S2 2 Push button
l TEXAS INSTRUMENTS
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Suggested Reading
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MSP-EXP430G2 LaunchPad™ Development Kit
7 Suggested Reading
The primary sources of information on MSP430 MCUs are the device-specific data sheets and the family
user's guides. The most up-to-date versions of those documents can be found at the TI MSP430 landing
page.
For more information on CCS and IAR, download the latest version from http://www.ti.com/mspds and
read the included user's guides and documentation in the installation folder. Documents describing the
IAR tools (Workbench/C-SPY, the assembler, the C compiler, the linker, and the library) are located in
common\doc and 430\doc. All necessary CCS documents can be found in the msp430\doc folder in the
CCS installation path. The FET user's guide also includes detailed information on how to set up a project
for the MSP430 MCUs using IAR or CCS, and it is included in most of the IDE releases and on the TI
MSP430 MCU website.
8 Frequently Asked Questions (FAQ)
1. Can other programming tools like the MSP-FET430UIF interface the socket device on the MSP-
EXP430G2 LaunchPad development kit?
The LaunchPad development kit works with any programming tool that supports the 2-wire Spy-Bi-Wire
interface. Both the MSP430 USB FET (MSP-FET430UIF) and the Gang Programmer (MSP-GANG430)
support these devices, but the connection must be made directly to the dedicated Spy-Bi-Wire ports.
See MSP-FET430 Flash Emulation Tool User's Guide (SLAU138) for details on using MSP430 USB
FET and the Gang Programmer for a 2-wire Spy-Bi-Wire interface. Do not try to connect the standard
JTAG connector to the MSP-EXP430G2 pinheads, as this could result in damage to the attached
hardware.
2. Does the MSP-EXP430G2 support fuse blow?
The onboard debugging interface of the MSP-EXP430G2 LaunchPad development kit lacks the JTAG
security fuse-blow capability. To ensure firmware security on devices going to production, the USB
Flash Emulation Tool or the Gang Production Programmer, which support the fuse-blow feature, are
recommended.
3. What versions of IAR Embedded Workbench IDE and Code Composer Studio IDE are supported?
The hardware of the MSP-EXP430G2 LaunchPad development kit is supported by IAR Embedded
Workbench KickStart Version 6.00 or higher and Code Composer Studio v4 or higher. To download
the IDEs, visit http://www.ti.com/mspds.
4. What are the part numbers for the connectors between the emulator board of the LaunchPad
development kit and the other eZ430 target boards?
Header: MALE CONN HEADER .050" 6POS PCB R/A (for example, Digi-Key: S9016E-06-ND)
Socket: FEMALE CONN HEADER .050" 6POS PCB R/A (for example, Digi-Key: S9010E-06-ND)
5. I am not able to select the MSP430 Application UART and cannot receive data.
Ensure that the Application UART driver is correctly installed. This is done by installing either IAR
Embedded Workbench or Code Composer Studio v4.
To determine if the driver is correctly installed:
a. Plug in the MSP-EXP430G2 LaunchPad development kit with the included mini USB cable.
b. Right click My Computer and select Properties.
c. Select the Hardware tab and click on Device Manager.
d. Under Ports (COM & LPT) should be an entry for "MSP430 Application UART (COM xx)".
If the entry is there, but no characters are received, reconnect the LaunchPad development kit to the
PC and restart the application to reload the drivers. If the Application UART is not listed, install the
driver by following the instructions in Section 3.2.
If the application UART is installed but not receiving UART data, ensure that the jumpers on J3 are
configured for the proper UART communication. The two UART jumpers are configured vertically for a
software (SW) UART, and horizontally for a hardware (HW) UART. The application implementation and
J3 jumpers should match for UART data to be properly transmitted.
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MSP-EXP430G2 LaunchPad™ Development Kit
6. The device is not answering to any communication, JTAG or UART.
If you are experiencing difficulties in communicating to the attached MSP430 target device, even
though all the communication drivers for the MSP-EXP430G2 are loaded correctly, the emulator is
probably set to a wrong communication state. This can be fixed by reconnecting the LaunchPad
development kit and restarting the communicating application. Also make sure that all the jumpers on
J3 are connected properly between the emulator and the target device. On revision 1.5 and newer, the
orientation of the UART jumpers must align with the software implementation on the target device.
7. I soldered the 32-kHz crystal to the board and the oscillation is not starting.
The capability of the MSP430 MCU to drive the low-frequency crystal is limited, because this MCU is
designed for low-power applications. To ensure proper operation, the load on these pins must be as
small as possible, the matching capacitors (12.5 pF for 32.768 kHz) for the crystal must be soldered to
the board, and the resistors R28 and R29 must be removed. Measuring the frequency of the oscillation
with an oscilloscope typically disturbs the oscillation.
8. The power consumption of the board is much higher than specified in the device data sheet, or I am
not measuring a current at all.
The MSP430 MCU in the socket of the LaunchPad development kit can be powered with an external
power supply at header J6 or J4. To measure the power consumption in this mode, the VCC jumper,
usually used to measure the power consumption, must be removed, and the current must be
measured directly at the power supply. If the jumper J3 is not removed, the emulator circuitry of the
LaunchPad development kit is powered as well. Measuring the current consumption during a debug
session is not possible, because the cross current through the JTAG connection influences the
measurement. The most accurate results are achieved with all jumpers on J3 removed. If the
measurement is still not matching the data sheet parameters, make sure that the code is aligned with
all the power saving recommendations on the website MSP430™ - The World's Lowest Power MCU.
LaunchPad development kit revisions 1.3 and 1.4 come with R34 populated. The 47-kΩresistor is
used as a pullup for the button S2. If the port P1.3 is driven to ground, as suggested to keep the power
consumption down, the pullup resistor generates an additional current of approximately 77 µA. To
reduce the power consumption, the port should stay in input mode or the resistor should be removed if
button S2 is not used. The internal pullup of the MSP430G2xx can be used instead.
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Revision History
25
SLAU318GJuly 2010Revised March 2016
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Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from January 13, 2015 to March 18, 2016 ........................................................................................................ Page
Added the paragraph that starts "Information about MSP debug solutions..." to Section 1.2................................... 2
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