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EPC2012C N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar)
Price & Procurement
11,247 In Stock
Can ship immediately
 

Quantity
All prices are in TWD.
Price Break Unit Price Extended Price
1 89.00000 NT$89
10 80.00000 NT$800
25 75.52000 NT$1,888
100 64.33000 NT$6,433
250 60.40400 NT$15,101
500 52.85200 NT$26,426
1,000 43.79200 NT$43,792

Submit a request for quotation on quantities greater than those displayed.

Alternate Package
  • Tape & Reel (TR)  : 917-1084-2-ND
  • Minimum Quantity: 2,500
  • Quantity Available: 10,000 - Immediate
  • Unit Price: NT$42.46320
  • Digi-Reel®  : 917-1084-6-ND
  • Minimum Quantity: 1
  • Quantity Available: 11,247 - Immediate
  • Unit Price: Digi-Reel®

EPC2012C

Datasheet
Digi-Key Part Number 917-1084-1-ND
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Manufacturer

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Manufacturer Part Number EPC2012C
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Description GANFET TRANS 200V 5A BUMPED DIE
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Manufacturer Standard Lead Time 12 Weeks
Detailed Description

N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar)

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Product Attributes
Type Description Select All
Categories
Manufacturer EPC
Series eGaN®
Packaging Cut Tape (CT) 
Part Status Active
FET Type N-Channel
Technology GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) 200V
Current - Continuous Drain (Id) @ 25°C 5A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 5V
Rds On (Max) @ Id, Vgs 100mOhm @ 3A, 5V
Vgs(th) (Max) @ Id 2.5V @ 1mA
Gate Charge (Qg) (Max) @ Vgs 1.3nC @ 5V
Vgs (Max) +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds 140pF @ 100V
FET Feature -
Power Dissipation (Max) -
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Supplier Device Package Die Outline (4-Solder Bar)
Package / Case Die
 
Environmental & Export Classifications
Lead Free Status / RoHS Status Lead free / ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
For Use With

EPC9052

BOARD DEV EPC2012C EGAN FET

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NT$5,319.00000 Details

EPC9004C

BOARD DEV FOR EPC2012C 200V EGAN

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NT$3,330.00000 Details
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Additional Resources
Standard Package 1
Other Names 917-1084-1