Advanced Thermal Solutions Inc

電源磚散熱片

ATS 的電源磚散熱片專為八分之一磚、四分之一磚、半磚和全磚尺寸的 DC/DC 轉換器進行散熱

ATS 的電源磚散熱片圖片電源磚 DC/DC 電源轉換器在 PCB 設計中是不可或缺的一部份。需要穩定的溫度，才能達到最佳效能。ATS 生產多種高效能散熱片，以專利的 maxiFLOW 設計為基礎，能針對眾多電子產品應用中的 DC/DC 電源轉換器和電源模組有效進行散熱。

特點和優點
  • 可用於 DC/DC 電源轉換器和電源模組，例如 Vicor 的 V24A3V3x200Bx 和 Murata 的 MPDKN10_S
  • 高效能 maxiFLOW 設計具有更低壓降與更大表面積，能達到最大的有效空氣對流散熱
  • 提供預先組裝的高效能 Chomerics T-766 相變材料
  • 比其他電源磚散熱片的接面溫度降低 20%
  • 降低接面溫度 (Tj) 超過 20%
  • 提供三 (3) 組螺絲，長度為 5 mm、6 mm 和 8 mm
  • 長度選項：
    • 長：23 mm 至 58 mm
    • 寬：23 mm 至 58 mm
    • 高：6.1 mm 至 22.9 mm
    • 鰭片端頭至鰭片端頭：23 mm 至 58 mm

影片：DC-DC 轉換器和電源磚散熱片

Brick Heat Sinks

圖片製造商零件編號說明現有數量價格查看詳情
1/4 BRICK HEATSINK 58X37X11.4MMATS-1099-C1-R01/4 BRICK HEATSINK 58X37X11.4MM560 - 即時供貨$510.00查看詳情
1/8 BRICK HEATSINK 23X58X22.9MMATS-1186-C1-R01/8 BRICK HEATSINK 23X58X22.9MM337 - 即時供貨$562.00查看詳情
1/4 BRICK HEATSINK 37X58X11.4MMATS-1139-C1-R01/4 BRICK HEATSINK 37X58X11.4MM628 - 即時供貨$627.00查看詳情
FULL BRICK HEATSINK 117X61X11.4MATS-1109-C1-R0FULL BRICK HEATSINK 117X61X11.4M352 - 即時供貨$756.00查看詳情
1/2 BRICK HEATSINK 58X61X22.9MMATS-1146-C1-R01/2 BRICK HEATSINK 58X61X22.9MM236 - 即時供貨$782.00查看詳情
FULL BRICK HEATSINK 61X118X20MMATS-1151-C1-R0FULL BRICK HEATSINK 61X118X20MM2240 - 即時供貨$900.00查看詳情
1/8 BRICK HEATSINK 58X23X11.4MMATS-1179-C1-R01/8 BRICK HEATSINK 58X23X11.4MM131 - 即時供貨$413.00查看詳情
1/8 BRICK HEATSINK 23X59X11.4MMATS-1184-C1-R01/8 BRICK HEATSINK 23X59X11.4MM269 - 即時供貨$508.00查看詳情
1/2 BRICK HEATSINK 61X58X11.4MMATS-1104-C1-R01/2 BRICK HEATSINK 61X58X11.4MM2549 - 即時供貨$561.00查看詳情
1/2 BRICK HEATSINK 58X61X11.4MMATS-1144-C1-R01/2 BRICK HEATSINK 58X61X11.4MM116 - 即時供貨$660.00查看詳情
發佈日期： 2016-04-20

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

發佈日期：2018-01-26

DC to DC Converters and Power Brick Heat Sinks
DC to DC Converters and Power Brick Heat Sinks

發佈日期：2016-07-07

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiFLOW Power Brick Heat Sink Technology ATS’s power brick heat sinks are engineered to create minimum pressure drop and maximize fin surface area
maxiFLOW™ Heat Sinks maxiFLOW heat sinks feature a low profile spread fin array that maximizes surface area. Available in a wide variety of sizes and shapes.