Henkel LOCTITE® Bergquist®

Gap Pad® 1500

導熱、非增強型填隙材料

Bergquist 的 Gap Pad® 1500 圖片 Bergquist 的 Gap Pad® 1500 是理想的填隙混合物，具有保持最佳散熱效能的低模數特性，並且維持輕鬆處理能力。 此材料的兩側具自然黏性，因此可服貼鄰近的元件表面，將介面電阻降至最低。

特點

  • 熱傳導率：1.5 W/m-K
  • 非增強結構能達到額外的服貼度
  • 服貼性、低硬度
  • 電氣隔離

應用

  • 電信
  • 電腦與週邊裝置
  • 電源轉換
  • RDRAM 記憶體模組／晶片級封裝
  • 需將熱傳輸到框架、機殼或其他類型均熱片的區域

Gap Pad 1500

圖片製造商零件編號說明類型形狀外型現有數量查看詳情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.080-02-0404THERM PAD 101.6MMX101.6MM BLACK墊、片方形101.60mm x 101.60mm208 - 即時供貨查看詳情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.040-02-0404THERM PAD 101.6MMX101.6MM BLACK墊、片方形101.60mm x 101.60mm373 - 即時供貨查看詳情
THERM PAD 406.4X203.2MM BLACKGP1500-0.040-02-0816THERM PAD 406.4X203.2MM BLACK墊、片矩形406.40mm x 203.20mm317 - 即時供貨查看詳情
THERM PAD 406.4X203.2MM BLACKGP1500-0.080-02-0816THERM PAD 406.4X203.2MM BLACK墊、片矩形406.40mm x 203.20mm194 - 即時供貨查看詳情
THERM PAD 406.4X203.2MM BLACKGP1500-0.125-02-0816THERM PAD 406.4X203.2MM BLACK墊、片矩形406.40mm x 203.20mm118 - 即時供貨查看詳情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.125-02-0404THERM PAD 101.6MMX101.6MM BLACK墊、片方形101.60mm x 101.60mm46 - 即時供貨查看詳情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.020-02-0404THERM PAD 101.6MMX101.6MM BLACK墊、片方形101.60mm x 101.60mm0 - 即時供貨查看詳情
THERM PAD 406.4X203.2MM BLACKGP1500-0.060-02-0816THERM PAD 406.4X203.2MM BLACK墊、片矩形406.40mm x 203.20mm0 - 即時供貨查看詳情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.060-02-0404THERM PAD 101.6MMX101.6MM BLACK墊、片方形101.60mm x 101.60mm0 - 即時供貨查看詳情
THERM PAD 15X15MM BLACKGP1500-0.125-02-15MMX15MMTHERM PAD 15X15MM BLACK間隙填料墊、片方形15.00mm x 15.00mm1 - 即時供貨查看詳情
THERM PAD 406.4X203.2MM BLACK2166082THERM PAD 406.4X203.2MM BLACK墊、片矩形406.40mm x 203.20mm0 - 即時供貨查看詳情
發佈日期： 2013-10-07

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