BTJ Series Thermal Jumper Chips for Thermal Dissipation

Bourns BTJ series surface-mount components provide high thermal conductivity while also possessing insulating properties

Image of Bourns BTJ Series Thermal Jumper Chips The Bourns BTJ thermal jumper chip series for thermal dissipation in a variety of electronic applications is a unique surface-mount component that provides high thermal conductivity while also possessing insulating properties.

This series is suitable for thermal conductivity and dissipation in a variety of mobile devices and electronic equipment. In addition, by taking advantage of its insulating properties, the space between the heating element and the heat detection element can be occupied, enabling highly accurate heat detection. These features also reduce the temperature rise of key components, thereby improving reliability at the system level.

Features
  • High thermal conductivity (AIN: 170 W/mK)
  • High insulation resistance
  • Low capacitance
  • Operating temperature: -55°C to +155°C
  • RoHS compliant and halogen-free
Applications
  • Power supplies
  • Switching power supplies
  • Converters
  • Amplifiers/RF, GaN
  • Various ECUs
  • Pin and laser diodes
  • Data servers

BTJ Series Thermal Jumper Chips

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發佈日期: 2026-04-27