新產品

Everspin Technologies SC 系列傳統插槽式記憶體的直接替代品可實現無縫升級，同時提高系統效能和可靠度。

EverSpin's 24-ball BGA MRAM packages.

The EMxxLXB is the industry’s first xSPI serial interface persistent memory based on Everspin’s unique industrial STT MRAM technology.

The Highest Performing Persistent Memory in the Industry.

MikroElektronika 的 MIKROE-2914 MRAM click Board™ 採用 Everspin Technologies 的 MR25H256 256 kb 序列 SPI MRAM 記憶體模組。

Five Amazon Echo Dots will be given away at Embedded World 2018 to qualified customers

EverSpin's alternative format for trace codes.

Replacing the Cypress CY14B104NA-BA/ZS45XI nvSRAM with Everspin’s MR2A16Axxx35 MRAM.

Everspin's 48-ball BGA MRAM packages.

Comparing technologies: MRAM vs. FRAM from EverSpin.

EverSpin's TSOP2 MRAM package guide.

EverSpin's MRAM DFN package guide.

EverSpin's SOIC MRAM package guide.

A look at combining FPGA technology with embedded processors including monolithic approaches, SoC solutions, tack-ups, and modules.

Designers working with microcontrollers (MCUs) have come to rely heavily on flash memory for code storage because IC makers have scaled the manufacturing processes for the nonvolatile memory and are producing quite large flash arrays on MCU ICs.

EverSpin Technologies 是開發及製造磁性記憶體 (MRAM) 和感測器的全球領導廠商。

Replacing the Cypress CY14B104LA-ZS/BA45xxx nvSRAM with Everspin’s MR2A08AxYS/MA35xxx MRAM.

To increase production capacity and improve flexibility in manufacturing Everspin will qualify nine additional products for assembly in TSOP-44 packages at ASE group.

EverSpin’s 2mm exposed pad DFN package meets both SOIC-8 and DFN8 PCB layouts.

Toggle and spin-torque MRAM status and outlook from EverSpin.