XCede® Connectors

Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. The use of engineering polymers in a resonance-damping shield enables very low crosstalk across a wide frequency range.

XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82.4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling straight through the backplane. Complementary guidance and power modules are also included in the product range. A wafer organizer can be used to combine groups of right-angle signal, guidance and power modules as an integrated daughter-card connector.

The XCede backplane header system provides the ruggedness and long-term reliability required by today’s systems. The wide ground contacts feature a stiffness-enhancing rib and are advanced well ahead of the signals for exceptional robustness and signal pin protection.