

Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | 3M | |
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | SOIC | |
Number of Positions or Pins (Grid) | 14 (2 x 7) | |
Pitch - Mating | - | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | - | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | - | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyethersulfone (PES), Glass Filled | |
Operating Temperature | -55°C ~ 150°C | |
Termination Post Length | 0.140" (3.56mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating (Amps) | 1 A | |
Contact Resistance | - | |
Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | NT$1,363.00000 | NT$1,363 |
| 10 | NT$1,158.30000 | NT$11,583 |
| 30 | NT$1,071.93333 | NT$32,158 |
| 50 | NT$1,034.02000 | NT$51,701 |
| 100 | NT$984.70000 | NT$98,470 |
| 250 | NT$923.12800 | NT$230,782 |


