14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
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14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
DILB14P-223TLF
DILB14P-223TLF

DILB14P-223TLF

DigiKey Part Number
609-4712-ND
Manufacturer
Manufacturer Product Number
DILB14P-223TLF
Description
CONN IC DIP SOCKET 14POS TIN
Customer Reference
Detailed Description
14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
Datasheet
 Datasheet
EDA/CAD Models
DILB14P-223TLF Models
Product Attributes
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Category
Termination
Solder
Manufacturer
Amphenol ICC (FCI)
Pitch - Post
0.100" (2.54mm)
Packaging
Tube
Contact Finish - Post
Tin
Part Status
Last Time Buy
Contact Finish Thickness - Post
100.0µin (2.54µm)
Type
DIP, 0.3" (7.62mm) Row Spacing
Contact Material - Post
Copper Alloy
Number of Positions or Pins (Grid)
14 (2 x 7)
Housing Material
Polyamide (PA), Nylon
Pitch - Mating
0.100" (2.54mm)
Operating Temperature
-55°C ~ 105°C
Contact Finish - Mating
Tin
Termination Post Length
0.124" (3.15mm)
Contact Finish Thickness - Mating
100.0µin (2.54µm)
Material Flammability Rating
UL94 V-0
Contact Material - Mating
Copper Alloy
Current Rating (Amps)
1 A
Mounting Type
Through Hole
Contact Resistance
30mOhm
Features
Open Frame
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
Substitutes (2)
Part NumberManufacturerQuantity AvailableDigiKey Part NumberUnit PriceSubstitute Type
111-43-314-41-001000Mill-Max Manufacturing Corp.5,977ED90114-NDNT$128.00000Similar
4814-3000-CP3M2,4423M5462-NDNT$23.00000Similar
In-Stock: 7,398
Check for Additional Incoming Stock
Last Time Buy Date: 2026/6/26
All prices are in TWD
Tube
QuantityUnit PriceExt Price
1NT$20.00000NT$20
10NT$16.70000NT$167
34NT$15.32353NT$521
68NT$14.58824NT$992
102NT$14.17647NT$1,446
272NT$13.22059NT$3,596
510NT$12.64706NT$6,450
1,020NT$12.04314NT$12,284
2,516NT$11.29928NT$28,429
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.