TS991SNL500T3
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TS991SNL500T3

DigiKey Part Number
315-TS991SNL500T3-ND
Manufacturer
Manufacturer Product Number
TS991SNL500T3
Description
SOLDER PASTE THERMALLY STABLE NC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
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In-Stock: 3
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All prices are in TWD
Bulk
QuantityUnit PriceExt Price
1NT$3,546.00000NT$3,546
5NT$3,055.40000NT$15,277
10NT$2,865.10000NT$28,651
25NT$2,631.00000NT$65,775
50NT$2,466.14000NT$123,307
100NT$2,311.06000NT$231,106
Manufacturers Standard Package