
TS991SNL500T3 | |
|---|---|
DigiKey Part Number | 315-TS991SNL500T3-ND |
Manufacturer | |
Manufacturer Product Number | TS991SNL500T3 |
Description | SOLDER PASTE THERMALLY STABLE NC |
Manufacturer Standard Lead Time | 4 Weeks |
Customer Reference | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) |
Datasheet | Datasheet |
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | Chip Quik Inc. | |
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | Solder Paste | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Diameter | - | |
Melting Point | 423°F (217°C) | |
Flux Type | No-Clean | |
Wire Gauge | - | |
Mesh Type | 3 | |
Process | Lead Free | |
Form | Jar, 17.64 oz (500g) | |
Shelf Life | 12 Months | |
Shelf Life Start | Date of Manufacture | |
Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | NT$3,546.00000 | NT$3,546 |
| 5 | NT$3,055.40000 | NT$15,277 |
| 10 | NT$2,865.10000 | NT$28,651 |
| 25 | NT$2,631.00000 | NT$65,775 |
| 50 | NT$2,466.14000 | NT$123,307 |
| 100 | NT$2,311.06000 | NT$231,106 |


