HBA25031-10/CU/Y
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HBA25031-10/CU/Y

DigiKey Part Number
4573-HBA25031-10/CU/Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
HBA25031-10/CU/Y
Description
CU HEAT SINK 25X25X10MM WITH LIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
HBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Fins
Length
0.984" (25.00mm)
Width
0.984" (25.00mm)
Diameter
-
Fin Height
0.307" (7.80mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 35
Check for Additional Incoming Stock
Quantity
All prices are in TWD
Tray
QuantityUnit PriceExt Price
1NT$172.00000NT$172
10NT$152.50000NT$1,525
25NT$145.28000NT$3,632
50NT$140.04000NT$7,002
100NT$134.98000NT$13,498
250NT$128.56400NT$32,141
450NT$124.60444NT$56,072
950NT$119.74000NT$113,753
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
You May Also Be Interested InSee All
3 Items
MBH14002-09P/CU/2

MBH14002-09P/CU/2

CU HEAT SINK 14X14X9MM WITH PIN

Malico Inc.

NT$166.00000
HBH37.5031-10/CU

HBH37.5031-10/CU

CU HEAT SINK 37.5X37.5X10MM WITH

Malico Inc.

NT$220.00000
18704

18704

HEATSINK - 13.20 X 12.10 MM (COP

SparkFun Electronics

NT$92.00000