Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
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HSB07-202009

DigiKey Part Number
2223-HSB07-202009-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB07-202009
Description
HEAT SINK, BGA, 20 X 20 X 9 MM
Manufacturer Standard Lead Time
12 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
Datasheet
 Datasheet
Product Attributes
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Category
Length
0.787" (20.00mm)
Mfr
Width
0.787" (20.00mm)
Series
Fin Height
0.354" (9.00mm)
Packaging
Box
Power Dissipation @ Temperature Rise
3.1W @ 75°C
Part Status
Active
Thermal Resistance @ Forced Air Flow
8.60°C/W @ 200 LFM
Type
Top Mount
Thermal Resistance @ Natural
24.08°C/W
Package Cooled
Material
Attachment Method
Adhesive (Not Included)
Material Finish
Black Anodized
Shape
Square, Pin Fins
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Additional Resources
In-Stock: 2,962
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Quantity
All prices are in TWD
Box
QuantityUnit PriceExt Price
1NT$33.00000NT$33
10NT$29.50000NT$295
25NT$28.08000NT$702
50NT$27.10000NT$1,355
204NT$25.14216NT$5,129
408NT$24.23284NT$9,887
612NT$23.71569NT$14,514
1,020NT$23.08039NT$23,542
5,100NT$21.18569NT$108,047
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