HSB19-272718
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HSB19-272718

HSB19-272718

DigiKey Part Number
2223-HSB19-272718-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB19-272718
Description
HEAT SINK, BGA, 27 X 27 X 18 MM
Manufacturer Standard Lead Time
24 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 6.8W @ 75°C Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
6.8W @ 75°C
Thermal Resistance @ Forced Air Flow
4.50°C/W @ 200 LFM
Thermal Resistance @ Natural
11.11°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
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In-Stock: 109
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Quantity
All prices are in TWD
Box
QuantityUnit PriceExt Price
1NT$69.00000NT$69
10NT$61.00000NT$610
25NT$58.12000NT$1,453
50NT$56.00000NT$2,800
100NT$53.98000NT$5,398
250NT$51.42000NT$12,855
660NT$48.83182NT$32,229
1,320NT$47.06364NT$62,124
5,280NT$43.70985NT$230,788
Manufacturers Standard Package
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