The maxiFLOW™ works by taking advantage of the area that overhangs the BGA, where there is usually unused real estate. The heatsink is derived from a straight fin heatsink whose fins have been bent out symmetrically. The heatsink comes finished with an anodized coating and is made from lightweight, clean extruded aluminum. The maxiGRIP™ design grips underneath the BGA gently on all four corners and applies steady force on the heatsink to the top of the BGA. The frame clip, coincidently, helps protect the solderballs from contaminating dust or particulates which breach the filter.