HSB23-232325
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HSB23-232325

DigiKey Part Number
2223-HSB23-232325-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB23-232325
Description
HEAT SINK, BGA, 23 X 23 X 25 MM
Manufacturer Standard Lead Time
24 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 6.13W @ 75°C Top Mount
Datasheet
 Datasheet
EDA/CAD Models
HSB23-232325 Models
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.906" (23.00mm)
Width
0.906" (23.00mm)
Diameter
-
Fin Height
0.984" (25.00mm)
Power Dissipation @ Temperature Rise
6.13W @ 75°C
Thermal Resistance @ Forced Air Flow
3.80°C/W @ 200 LFM
Thermal Resistance @ Natural
12.23°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
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In-Stock: 994
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Quantity
All prices are in TWD
Box
QuantityUnit PriceExt Price
1NT$54.00000NT$54
10NT$45.50000NT$455
25NT$42.08000NT$1,052
50NT$39.52000NT$1,976
100NT$37.03000NT$3,703
250NT$33.88000NT$8,470
704NT$33.03125NT$23,254
Manufacturers Standard Package
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