Heat Sink BGA Aluminum Alloy 5.9W @ 75°C Top Mount
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HSB32-232318

DigiKey Part Number
2223-HSB32-232318-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB32-232318
Description
HEAT SINK, BGA, 23 X 23 X 18 MM,
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 5.9W @ 75°C Top Mount
Datasheet
 Datasheet
EDA/CAD Models
HSB32-232318 Models
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.906" (23.00mm)
Width
0.906" (23.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
5.9W @ 75°C
Thermal Resistance @ Forced Air Flow
4.40°C/W @ 200 LFM
Thermal Resistance @ Natural
12.67°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
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In-Stock: 435
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Quantity
All prices are in TWD
Box
QuantityUnit PriceExt Price
1NT$49.00000NT$49
10NT$43.40000NT$434
25NT$41.36000NT$1,034
50NT$39.90000NT$1,995
100NT$38.45000NT$3,845
490NT$35.33673NT$17,315
980NT$34.05816NT$33,377
1,470NT$33.33061NT$48,996
5,390NT$31.10074NT$167,633
Manufacturers Standard Package
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