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Tflex™ CR910 Thermal Interface Material - Laird Thermal Materials
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Tflex™ CR910 Thermal Interface Material Publish Date: 2026-03-24

The Laird Thermal Materials Tflex™ CR910 is a two-part dispensable gap filler that provides low thermal resistance and high reliability.

Image of Laird - Thermal Materials Tputty 607MF Gap Filler Tputty™ 607MF Gap Filler Publish Date: 2025-04-30

Laird Thermal Systems Tputty™ 607MF gap filler is a soft, ceramic-filled dispensable material with good vertical reliability and tackiness.

Image of Laird Tflex CR550 Thermal Insulation Material Tflex™ CR550 Thermal Insulation Material Publish Date: 2025-01-22

Laird Tflex™ CR550 thermal insulation materials offer low cost, mid-range thermal conductivity, and vertical stability to satisfy designer requirements.

Image of Laird Tputty™ 910 Thermal Conductive Material Updated Tputty™ 910 Thermal Conductive Material Updated: 2026-04-07

Laird Tputty 910 thermal conductive material is a one-part, dispensable gap filler that is ready to use and does not require any curing operation.

Image of Laird Tflex™ SF Product Portfolio Expansion Tflex™ SF Product Portfolio Expansion Publish Date: 2024-09-18

Laird Tflex™ SF soft, non-silicone gap fillers offer superior thermal performance without overstressing boards and components.

Image of Laird's Tflex™ CR607 Dispensable Gap Filler Tflex™ CR607 Dispensable Gap Filler Publish Date: 2024-01-16

At 6.4 W/m-K thermal conductivity, Laird Performance Materials' Tflex CR607 solves numerous design issues as a two-part, cure-in-place dispensable gap filler.

Image of Laird's Tflex™ HD 7.5 Silicone-based Thermal Gap Filler Tflex™ HD7.5 Silicone-Based Thermal Gap Filler Publish Date: 2023-05-16

Laird's Tflex™ HD7.5 is a soft silicone gap filler comprised of thermal conductivity of 7.5 W/mk and features pressure versus deflection characteristics.

Image of Laird's Tflex™ RB300 Exceptionally Soft Thermal Gap Filler Tflex™ RB300 Exceptionally Soft Thermal Gap Filler Publish Date: 2022-11-10

Laird Performance Materials' Tflex™ RB300 series gap fillers are targeted for applications requiring a low thermal resistance for low-pressure applications.

Image of Laird Technologies' Ttape™ 1000A Thermally Conductive Adhesive Tape Ttape™ 1000 A Thermally Conductive Adhesive Tape Publish Date: 2022-06-23

Laird's Ttape pressure sensitive adhesive tape is designed to facilitate the transfer of thermal energy from heat sources, such as IC chips, to heat sinks.

Image of Laird Technologies' Tflex™ HP34 Series High-Performance Gap Filler Material Tflex™ HP34 Series High-Performance Gap Filler Material Publish Date: 2021-06-21

Laird Technologies' Tflex™ HP34 series high-performance gap filler material consists of graphite fibers aligned to provide a high bulk thermal conductivity.

Image of Laird's Tflex SF10 Thermal Gap Filler Tflex SF10 Thermal Gap Filler Publish Date: 2021-06-08

Laird's Tflex SF10 is a high-performing non-silicone product that is also extremely soft and exhibits very low pressure on components.

Image of Laird Thermal Materials' Tflex™ B200 Thermal Gap Filler Tflex™ B200 Thermal Gap Filler Publish Date: 2019-11-22

Laird Thermal Materials' Tflex B200 is a reliable, compliant thermal interface material offering good thermal performance and easy handling.

Image of Laird Technologies - Thermal Products' Tgon™ 800 Series Tgon™ 800 Series Publish Date: 2013-10-07

Laird Technologies' Tgon 800 is a high performance, cost effective thermal interface material.

Image of Laird Technologies - Thermal Products' Tgard™ K52 Series Tgard™ K52 Series Publish Date: 2012-06-29

Laird Thermal's Tgard K52 Series is a high thermal and dielectric performance insulator pad consisting of a ceramic filled phase change compound.

Image of Laird Technologies - Thermal Products' Tflex™ SF600 Series Tflex™ SF600 Series Publish Date: 2012-06-29

Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3.0 W/mK.

Image of Laird Technologies - Thermal Products' Tputty™ 502 Series Tputty™ 502 Series Publish Date: 2012-06-29

The Tputty 502 Series is the best material for applications where large tolerance differences create the need for compression of interface material.

Image of Laird Technologies - Thermal Products' Tflex SF600D Series Tflex™ SF600D Series Publish Date: 2012-06-29

Laird Technologies' Tflex™ SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 - 3.0 W/mK.

Image of Laird Technologies - Thermal Products' Tflex™ 700 Series Tflex™ 700 Series Publish Date: 2012-06-29

Laird Thermal's Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy.

Image of Laird Technologies - Thermal Products' Tflex™ 300 Series Tflex™ 300 Series Publish Date: 2012-06-29

Laird Thermal's Tflex 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price.

Image of Laird Technologies - Thermal Products' Tflex™ 200 V0 Series Tflex™ 200 V0 Series Publish Date: 2012-06-29

Laird Thermal's Tflex 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers.