設定
快速送達
免運費
國貿條規
付款類型
商城產品
Slide 1
Slide 2
Slide 3
Slide 4
Slide 5
Slide 6
Slide 7
Slide 8
Slide 9
Slide 10
Slide 11
Slide 12
Slide 13
Slide 14
Slide 15
Slide 16
Product List
One other consideration is the choice of surface mounting. A commonly used method is the LGA solder bumping type. The main disadvantages are that X-Ray equipment has to be used to inspect the solder joints and that any rework is difficult without special tooling.
PTM Published on: 2013-04-01
台灣